Quality Dicing Starts with a Quality Saw

Here at Catalyst Microtech, we are equipped with a K&S 982-10 wafer dicing saw. The 982-10 provides improved dicing capability with a PRS vision system. Utilizing the PRS vision system and a resolution of 0.8 microns, we reduce the percentage of lost die with a cut placement accuracy of 4 microns and a cut accuracy of 2 microns.

Program recall saves setup time and reduces defects or errors by using previously qualified dicing programs. This feature reduces your cost because we only need to program our machine once.

Hubbed and hubless saw blades are used which expands the variety of substrate materials that can be diced. Depending on the material to be cut, silicon, glass, ceramic or exotic materials, Catalyst Microtech has the tools and the blades to meet your needs.

When your assembler dices your silicon, are you sure they have the proper ESD protection built into their equipment? A proper setup for dicing ESD sensitive materials requires the use of a re-ionized water system which is usually built into the saw. The K&S 982-10 wafer saw at Catalyst Microtech incorporates a built-in re-ionizer to safely cut your ESD sensitive devices without risk of damage.

The K&S 982-10 saw is especially suitable for area array substrate singulation. Using a special 10" wafer chuck, the 982-10 allows larger substrate arrays to be diced. Because of the larger capability, the per unit cost is dramatically reduced resulting in a cost savings to you.

If you're interested in dicing variable die sizes from a single wafer (Multi-index dicing), then the K&S 982-10 performs this task with ease. These programs are typically more complex to setup and more prone to mistakes than other types of programs. With the use of our PRS system, repeated dicing using previously verified programs guarantees successful results in record time.