The Foundation of an Assembly Process

The die attach process forms the foundation that the rest of the packaging processes are built upon. This key process is not quite as simple as it may seem and is complicated only by the variety of choices, materials, and equipment that can be used. Without the right equipment, certain packaging technologies could not be performed. Some technologies may require special software or high accuracy die placement or optional features such as Z-height measurement or bond force control.

At Catalyst Microtech, we selected the ESEC / Zevatech - Micron 2 high accuracy die attach machine as our die attach platform. The Micron 2 provides flip chip capability as well as a software package fully capable of building any application. These features combined with the ± 12 micron placement accuracy makes this machine fully capable of performing all your die attach needs.

Our Micron 2 machines are equipped with a wafer stage that allows us to pick automatically from 8" wafers. They have the added capability to use electronic wafer maps to determine which die to pick.

When your requirements call for higher volumes, Catalyst Microtech is prepared. We currently have two Micron 2 machines online. Each machine setup includes input/output elevator systems for high volume production.

When an application doesn't require the placement accuracy of a Micron 2, we utilize our ESEC CT-2000 die attach machine for production work. The CT-2000 contains the same software package as the Micron 2 but only has a die placement accuracy of ± 2 mil. The CT-2000 is fully capable of die pick from wafers and setup also includes input/output elevators for high volume production.

For low volume prototypes, we may use our K&S 6497 semi-automatic die attach machines. A 6497 can be setup and running parts within minutes, unlike our other equipment which requires a program creation process that takes time. With a built-in vision alignment system, these machines have increased throughput that allows us to deliver your prototypes quicker.

In some applications, the die attach method may require a eutectic process. We provide this capability through the use of a Marpet 709 Eutectic die bonder.

Catalyst Microtech has made a large investment in our die attach equipment in order to provide the capabilities as well as capacity you require. From the simplest of applications to the cutting edge assemblies, Catalyst Microtech has the equipment to perform.